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Support
Semiconductor Support Services provides a depth of experience and capability.
| Process Services Available
Etch
- Metal
- Nitride
- Oxide
- Polysilicon
- Single Crystal Silicon (Trench)
- Tungsten
- Tungsten Silicide
Metal Chemical Vapor Deposition
- Tungsten
- Tungsten Silicide
- Titanium Nitride
Dielectric CVD
- PETEOS
- Thermal TEOS
- Sub Atmospheric TEOS
- Dual Frequency TEOS
- Boron and/ or Phosphorus Doped TEOS
- Fluorine Doped TEOS
- Silane Nitride
- Silicon Oxy-nitride
- Dielectric Anti-Reflective Coating
- Silane Boron and/ or Phosphorus doped Silicate Glass
- Low ? Dielectrics
- High Density Plasma CVD
- Advanced Insitu-chamber Clean
Rapid Thermal Processes
- Polysilicon
- Epitaxial Silicon
- Nitride
- RTP Implant Activation
Physical Vapor Deposition
- Aluminum
- Titanium Nitride
- Titanium
- Titanium Tungsten
- Hot Aluminum
- Cobalt Titanium
- Pre Clean I
- Pre Clean II
- Copper Seed
- Collimated Processes
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Hardware Experience Available
APPLIED MATERIALS®
- 8130
- 8110
- 8310
- 8330
- Etch Mk II
- Etch MXP®
- Etch MXP+™
- Etch eMxP+®
- Etch RPS
- DxL
- DxZ®
- PRODUCER®
- HDPCVD
- WxL
- WXZ™
- WEB
- WSiX
- Aluminum PVD
- Ti/TiN PVD
- TiW PVD
- Collimated PVD
- PC I&II
- HTF Poly
- HTF Atmospheric EPI
- HTF Reduced Pressure EPI
- SEM Hardware and Applications
- EXCITE™ Hardware and Applications
Mainframes
- 5000 All Variants
- 5200 All Variants
- 5300 Etch HDP
- 5500 All Variants
- Producer®
Analytical Skills
- SEM
- SIMS
- ECX
- TXRF
- FTIR
- XPS/ESCA
- Various Film Thickness Analyzers
- Design of Experiments
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