ESC Fabrication

Single Piece Construction eliminates glue layers which lead to early failure and unpredictable dielectric constant. The ceramic ESC's are Coulombic with highly dense Al2O3 layer which has high electrical resistivity. This avoids de-chucking and sticking issues due to changes in surface condition as seen in some Johnson-Rahbeck designs..

Improved Cooling Design delivers better temperature uniformity and control to the wafer edge, which can help process performance.

For anodised Lam chucks a highly dense proprietary MA coating dramatically improves lifetime.